On 4/28/20 1:49 PM, Patrice Chotard wrote:

dwc3-sti-glue has been broken since MISC uclass has been modified to scan DT sub-nodes after bind. Fixing it by a using the no-op uclass.

Signed-off-by: Patrice Chotard patrice.chotard@st.com

drivers/usb/host/dwc3-sti-glue.c | 2 +- 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/drivers/usb/host/dwc3-sti-glue.c b/drivers/usb/host/dwc3-sti-glue.c index c99a1985cca5..99d4e29414aa 100644 --- a/drivers/usb/host/dwc3-sti-glue.c +++ b/drivers/usb/host/dwc3-sti-glue.c @@ -239,7 +239,7 @@ static const struct udevice_id sti_dwc3_glue_ids[] = {

U_BOOT_DRIVER(dwc3_sti_glue) = { .name = "dwc3_sti_glue",

• .id = UCLASS_MISC,

• .id = UCLASS_NOP, .of_match = sti_dwc3_glue_ids, .ofdata_to_platdata = sti_dwc3_glue_ofdata_to_platdata, .probe = sti_dwc3_glue_probe,

Applied, thanks.