On 3/12/20 1:59 PM, Patrice Chotard wrote:

dwc3-sti-glue has been broken since MISC uclass has been modified to scan DT sub-nodes after bind. Fixing it by a using the no-op uclass.

I wonder how many other drivers were broken by this change then ?

Signed-off-by: Patrice Chotard patrice.chotard@st.com

drivers/usb/host/dwc3-sti-glue.c | 2 +- 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/drivers/usb/host/dwc3-sti-glue.c b/drivers/usb/host/dwc3-sti-glue.c index ad7cf6e6b53d..f25e1dc6640c 100644 --- a/drivers/usb/host/dwc3-sti-glue.c +++ b/drivers/usb/host/dwc3-sti-glue.c @@ -245,7 +245,7 @@ static const struct udevice_id sti_dwc3_glue_ids[] = {

U_BOOT_DRIVER(dwc3_sti_glue) = { .name = "dwc3_sti_glue",

• .id = UCLASS_MISC,

• .id = UCLASS_NOP, .of_match = sti_dwc3_glue_ids, .ofdata_to_platdata = sti_dwc3_glue_ofdata_to_platdata, .probe = sti_dwc3_glue_probe,