Re: [PATCH 2/2] arm: dts: k3: binman: am625: add support for signing TIFSSTUB Images

4 Apr 2024


      On Thu, Apr 04, 2024 at 10:20:21AM +0530, Neha Malcom Francis wrote:
...
On 03/04/24 17:33, Dhruva Gole wrote:
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From: Kamlesh Gurudasani kamlesh@ti.com
Add support for signing of TIFSSTUB images for HSSE, HSFS and GP devices
and include them in tispl.bin and tispl.bin_unsigned.
Signed-off-by: Kamlesh Gurudasani kamlesh@ti.com
Signed-off-by: Dhruva Gole d-gole@ti.com
[...]
...
...
@@ -270,7 +406,8 @@
   			conf-0 {
   				description = "k3-am625-sk";
   				firmware = "atf";

			loadables = "tee", "dm", "spl";




			loadables = "tee", "tifsstub-hs", "tifsstub-fs",


				  "tifsstub-gp", "dm", "spl";
		fdt = "fdt-0";
	};
};



If there are multiple boards that will support TIFSSTUB in future, I would
I would assume that this will be the case. Verdin AM62 would need the
same, for example.
Francesco

    

Francesco Dolcini