On Fri, 7 Jul 2023 at 13:35, Neha Malcom Francis n-francis@ti.com wrote:
Board config binary artifacts must be generated to be used by binman to package sysfw.itb and tiboot3.bin for all K3 devices.
For devices that follow combined flow, these board configuration binaries must again be packaged into a combined board configuration blobs to be used by binman to package tiboot3.bin.
Add common k3-binman.dtsi to generate all the board configuration binaries needed.
Also add custMpk.pem and ti-degenerate-key.pem needed for signing GP and HS bootloader images common to all K3 devices.
Signed-off-by: Neha Malcom Francis n-francis@ti.com
arch/arm/dts/k3-binman.dtsi | 116 ++++++++++++++++++++++++++++++++++++ 1 file changed, 116 insertions(+) create mode 100644 arch/arm/dts/k3-binman.dtsi
Reviewed-by: Simon Glass sjg@chromium.org