On 05/16/2016 02:51 PM, Masahiro Yamada wrote:
Synopsys DWC3 IP generally works with an SoC-specific glue layer. DT binding for that is like this:
usb3_glue { compatible = "foo,dwc3"; ...
usb3 { compatible = "snps,dwc3"; ... };};
The glue layer initializes some SoC-specific parts, then populates the child DWC3 core. To see how it works, refer to
drivers/usb/dwc3/dwc3-exynos.c drivers/usb/dwc3/dwc3-keystone.c drivers/usb/dwc3/dwc3-omap.c drivers/usb/dwc3/dwc3-st.c
of Linux Kernel.
This commit implements a driver compatible with "snps,dwc3", allowing to use the same binding in U-Boot. The glue layer can be simply implemented based on Simple Bus Uclass.
Signed-off-by: Masahiro Yamada yamada.masahiro@socionext.com Reviewed-by: Marek Vasut marex@denx.de
Applied, thanks!