On Fri, 21 Apr 2023 at 06:32, Neha Malcom Francis n-francis@ti.com wrote:
By providing entries in the binman node of the device tree, binman will be able to find and package board config artifacts generated by TIBoardConfig with sysfw.bin and generate the final image sysfw.itb. It will also pick out the R5 SPL and sign it with the help of TI signing entry and generate the final tiboot3.bin.
Entries for A72 build have been added to k3-j721e-binman.dtsi to generate tispl.bin and u-boot.img.
Support has been added for both HS-SE(SR 1.1), HS-FS(SR 2.0) and GP images In HS-SE, the encrypted system firmware binary must be signed along with the signed certificate binary.
tiboot3.bin and sysfw-j721e_sr1_1-hs.itb: For HS-SE devices tiboot3.bin_fs and sysfw-j721e_sr2-hs-fs.itb: For HS-FS devices tiboot3.bin_unsigned and sysfw-j721e-gp-evm.itb: For GP devices <filename>.bin/img: For HS devices <filename>.bin_unsigned/img_unsigned: For GP devices
Intention of patch is to move signing and packaging to binman, thus making makefile target only if binman is not enabled.
It is to be noted that the bootflow followed by J721E requires:
tiboot3.bin: * R5 SPL * R5 SPL dtbs
sysfw.itb: * TIFS * board-cfg * pm-cfg * sec-cfg * rm-cfg
tispl.bin: * DM * ATF * OPTEE * A72 SPL * A72 SPL dtbs
u-boot.img: * A72 U-Boot * A72 U-Boot dtbs
Signed-off-by: Neha Malcom Francis n-francis@ti.com
arch/arm/dts/k3-j721e-binman.dtsi | 732 ++++++++++++++++++ .../k3-j721e-common-proc-board-u-boot.dtsi | 1 + .../arm/dts/k3-j721e-r5-common-proc-board.dts | 1 + arch/arm/mach-k3/config.mk | 4 + board/ti/j721e/Kconfig | 2 + scripts/Makefile.spl | 2 + 6 files changed, 742 insertions(+) create mode 100644 arch/arm/dts/k3-j721e-binman.dtsi
Reviewed-by: Simon Glass sjg@chromium.org
Wow this is complicated!