On Fri, Jan 24, 2020 at 05:22:50PM +0000, Alex Nemirovsky wrote:
We have many common features across ISAs and common ARM, MIPS, other ISA modification across SoCs. Looking at how this was addressed by other silicon vendors who support multiple ISAs, lead to this path. i.e. TI, freescale, and others.
./board/BuR/common ./board/xilinx/common ./board/atmel/common ./board/ti/common ./board/seco/common ./board/gdsys/common ./board/avionic-design/common ./board/LaCie/common ./board/cortina/common ./board/xes/common ./board/varisys/common ./board/engicam/common ./board/siemens/common ./board/mscc/common ./board/toradex/common ./board/compulab/common ./board/alliedtelesis/common ./board/freescale/common ./board/keymile/common ./board/samsung/common ./board/google/common ./board/ge/common
Yes. And in I believe all of the above cases there is also a relevant arch/*/mach-* directory. This can be a hard distinction to make sometimes, especially at first, but board/VENDOR/common is for the parts that are common but outside of a specific SoC. What you're putting in there that is common between your MIPS and ARM platforms for example. To use board/ti/common as an example there are platforms under arch/arm/mach-omap2/{am33xx,omap5} and arch/arm/mach-k3/ that all share that code.
To use one of your examples, lowlevel_init.S is something that is for the SoC and would be shared by some other vendor that uses your platform, right? It's leveraging features of the SoC itself rather than the PCB design of the board.
Does that help? Thanks!